Hexagonal boron nitride (hBN) is a white, thermally conductive yet electrically insulating ceramic widely used across electronics, automotive, aerospace, and industrial sectors. Its unique flake-like structure offers exceptional thermal stability, oxidation resistance, and lubricity, making it ideal for heat sinks, thermal interface materials, high-temperature release agents, and advanced lubricants.

The superior dielectric strength and low coefficient of friction of hBN enhance equipment reliability and energy efficiency, addressing growing industry needs for performance and sustainability. Manufacturers leverage hBN’s compatibility with polymers, metals, and composites to develop lightweight, high-performance components that support miniaturization and energy-saving initiatives. As devices demand greater heat dissipation and wear resistance, hexagonal boron nitride emerges as a critical enabler in thermal management solutions and advanced coatings.

The global hexagonal boron nitride market size is expected to reach US$ 3.99 Bn by 2032, from US$ 1.72 Bn in 2025, growing at a CAGR of 12.8% during the forecast period.

Key Takeaways
Key players operating in the Global Hexagonal Boron Nitride Market are Saint-Gobain, Momentive, 3M Company, Denka Company Limited, and H.C. Starck. These market players hold significant market share by investing in R&D, expanding production capacity, and pursuing strategic partnerships to strengthen their market position.

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