As per a study by FMI, the global electronics adhesives market is anticipated to exhibit a CAGR of 8.6% during the forecast period 2021-2031 in the comparison CAGR of 7.5% registered between 2016 and 2020. The market for electronic adhesives is expected to surpass a valuation of US$ 4.9 billion by the year 2031.

Polyurethane material accounts for nearly 50% of the global electronics adhesives market share. Driven by the characteristics such as a longer life cycle and thermal resistance, polyurethane is predicted to be the fastest-growing segment in terms of material, registering a CAGR of 8.5% over the course of the assessment period.

Leading market players are launching innovations in electronic adhesives to cater to industry-specific applications. For instance, DELO launched a new pressure-sensitive electronic adhesives to address the increasing demand for applications in smartphone speaker surfaces and display frames for low fill factor. The introduction of these innovative products is expected to drive the market growth.

Asia-pacific is leading the global electronics adhesives market. Expansion of automobile sector and consumer electronics sectors is expected to bolster scope for application in the region.

Competitive Landscape

Market players are focusing on regional expansion strategies and acquisition to strengthen the foothold. Besides this, some of the market players are focusing at strategic collaborations with regional distributors and end users to expand their customer base.

Some of the leading companies operating in the electronics adhesives market are:

  • 3M
  • Dymax Corporation
  • DOW Chemical Company
  • Henkel AG & Co. KGaA
  • H.B. Fuller Company (Royal Adhesives & Sealants LLC)
  • Evonik Industries AG
  • Sika AG
  • Bostik AG
  • ThreeBond
  • Shin Etsu Silicones
  • Konishi Co, LTD.
  • TERAOKA SEISAKUSHO CO., LTD.
  • TOMOEGAWA
  • YAMATO Co.,Ltd

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More Insights on FMI’s Electronics Adhesives Market

The latest market study on global electronics adhesives market by Future Market Insights gives a detailed segmentation for the forecast period of 2021-2031. In order to gain a better perspective of the global market potential, its growth, trends, and opportunities, the market is segmented on the basis of

By Material Type

  • Polyurethane
  • Acrylics
  • Silicones
  • Epoxy

By Application

  • Thermal Management
  • Conformal Coatings
  • Encapsulation
  • Surface Mounting
  • Wire Tacking
  • Soldering
  • Underfills
  • Sealing
  • Constructional

End Use

  • Mobiles and Telecommunication Devices
  • Desktops and Networks
  • Televisions
  • Home Appliances
  • Automotive Electronics
  • Aerospace Electronics
  • Analytical & Measurement Instruments
  • Other Industrial

“Key market players are increasing their investments in product development to cater to the rising demand for electronics adhesives due to on-going development of next-generation wireless 5G infrastructure network,” says the FMI analyst. 

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