DisChem offers advanced alternatives to traditional HMDS for photoresist adhesion. Our SurPass adhesion promoters provide superior adhesion on a variety of substrates without the need for pre-wetting solvents or substrate dehydration bake. Non-hazardous and waterborne, SurPass enhances resist adhesion and coating properties, supporting improved performance in microlithography applications. Trust DisChem for reliable and environmentally friendly adhesion solutions.