The EBL Charge Dissipation Ridgway product effectively manages charge accumulation during electron beam lithography. This solution is formulated to enhance charge dissipation, preventing distortion and ensuring accurate patterning. Ideal for use in a variety of EBL applications, it supports high-quality results and reliable performance, making it a valuable addition to your lithography toolkit.

The Sulfamate Nickel Plating Solution from DisChem ensures smooth and uniform nickel plating on a variety of substrates. This solution is specially formulated to provide excellent coating thickness control and adhesion, making it ideal for applications where precision and durability are critical. Whether you're working on electronic components, automotive parts, or other items requiring nickel...

DisChem’s Electron Beam Nanolithography technology provides exceptional resolution for fabricating nanoscale patterns and structures. This advanced technology leverages the precision of electron beams to create highly detailed nanostructures on various substrates. Ideal for research and development in fields like nanotechnology and microelectronics, our electron beam nanolithography...

DisChem offers advanced alternatives to traditional HMDS for photoresist adhesion. Our SurPass adhesion promoters provide superior adhesion on a variety of substrates without the need for pre-wetting solvents or substrate dehydration bake. Non-hazardous and waterborne, SurPass enhances resist adhesion and coating properties, supporting improved performance in microlithography applications....

DisChem's EBL anti-charging agent, DisCharge, is formulated to mitigate charging effects during electron beam lithography. This agent enhances pattern accuracy and uniformity by effectively dissipating accumulated charge. Compatible with a variety of resist materials, DisCharge is an essential addition to your EBL process, ensuring precise and reliable results. Non-hazardous and easy to apply,...

SurPass photoresist adhesion promoters by DisChem ensure superior adhesion on a wide variety of substrate materials. Designed for microlithography, these promoters modify the substrate surface energy without depositing a film or altering the substrate chemistry. Easy to apply by spin coat, immersion, or spray, SurPass enhances resist adhesion, improves coating properties, and eliminates the...

DisChem's HSQ e beam resist offers unparalleled precision for electron beam lithography. Formulated with hydrogen silsesquioxane (HSQ), this resist ensures excellent pitch resolution, sensitivity, and etch resistance. Ideal for direct write thin film applications, it supports advanced microlithography processes, enhancing device performance while minimizing process waste. With immediate...